The application of non-destructive testing technology in road and bridge engineering is mainly reflected in the following aspects:
3.1 Application of spectrum analysis technology in road and bridge engineering
The so-called spectrum analysis technology is to judge the state of the detected object by analyzing the frequency characteristics of the surface wave propagated in different media. An instantaneous vertical impact force is applied to the surface of the road bridge structure, which produces a set of Rayleigh wave planes, which are mainly centered on the vibration source and have various frequencies. In this way, different Rayleigh wave surface signals can be obtained by hammering different parts, and sensors can be installed at different positions, and these Rayleigh wave frequencies can be detected. Through frequency analysis and coherent analysis techniques, different depths can be tested. The purpose of the mechanical parameters of the layered medium. Compared with the traditional method, it has the characteristics of high speed and high detection frequency. It can be used to detect the thickness uniformity of the layered media on the road surface and the contact between the layers.
3.2 Application of image technology in roads and bridges
So-called image technologies include laser holographic image technology and infrared imaging technology. The principle of infrared imaging technology: all substances are composed of molecules, and the heat is released in the next change of molecules. At the same time, the heat source energy emitted by different material structures is not the same. Therefore, it can be accurately judged by professional instruments. The temperature distribution formed by the surface of the object. The surface isotherm is drawn by the heat-sensitive element, and the defects in the road and bridge engineering can be identified by the distribution of the isotherm. The laser holography technology first obtains a hologram through a professional imaging device, and then judges the type of engineering defect and the position of the defect by analyzing the hologram and adding relevant calculations.
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